G40 Grypper
- Package Types BGA, QFN, LGA
- Footprint Net Zero (identical to package)
- Lid Not required
- Solder Balls Pre-reflowed on contacts
- Signal Path Short — low inductance, low insertion loss
Net zero package footprint engineering test socket for standard pitch BGA devices. Pre-reflowed solder balls on the G40 contacts ensure reliable solder volume at the PCB-to-socket interface.
The G40 builds on the G35 with solder balls reflowed onto the contacts, ensuring reliable solder volume at the PCB-to-socket interface for improved consistency in production and validation environments. The same oxide-cutting wipe action breaks through solder oxides during insertion for a reliable electrical connection every time.
No lid required as the package snaps directly, keeping full topside access for probing and scoping. Low insertion force protects packages during insertion. Net zero footprint means one PCB design across test, validation, and production, thereby reducing overall cost of test.
Overview
The G40 is the standard pitch Grypper with pre-reflowed solder balls for consistent solder volume at the PCB interface. The preferred choice for production and validation environments at standard BGA pitches.
Specifications:
- Footprint: Net zero (PCB footprint identical to package)
- Lid: Not required
- Contact feature: Pre-reflowed solder balls on contacts
- Contact action: Oxide-cutting wipe action
- Signal performance: Low inductance, low insertion loss
- Topside access: Full — for probing and scoping
Additional Information
- Package types: BGA, QFN, LGA
- Mounting: Surface mount reflow attachment
- Custom sizes: Available on request
- Certifications: ISO 9001, RoHS compliant
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